CPU-162-14

Rugged Com Express with 2nd Generation Intel® Core™

The CPU-162-14 is a COM Express module that delivers incredible performance and power efficiency: it supports dual and quad core 2nd Generation Intel® Core™ CPUs, providing the right power/performance profile for any application.

HIGHTLIGHTS


  • Intel® Core™i7 and Core™i5
  • Rugged:
    – Extended operating temperature
    – Direct mounted CPU and RAM
  • Three video ports
  • Wind River Linux and Windows

APPLICATIONS


  • Defense
  • Homeland Security
  • Aerospace
  • Industrial
  • Transportation

Designed for maximum reliability, the CPU-162-14 supports up to 8GB ECC memory, with memory and CPU soldered directly on the board to provide superior resilience to mechanical stress and vibrations.

With a Basic Module form factor, the CPU-162-14 packs a large number of peripherals in a very compact design: Gigabit Ethernet, four SATA, eight USB, three video ports, x16, x4 and two x1 PCI Express and PCI.

The CPU-162-14 simplifies programming and development with support for Window® 7, Windows® Embedded Standard 7 and Wind River Linux.

High Performance – Dual and quad core Core i5 and Core i7 for great performance to power ratio

Rugged – Direct-mounted SDRAM memory and CPU, ensuring extremely stable operation; ECC RAM support for extra reliability

Extended Temperature Range – Suitable for -40º to +85ºC operation

Feature Rich – SATA, USB, Gigabit Ethernet, Video, PCI and PCI Express

Compact design – COM Express Basic Module size (125mm x 95mm)

Operating Systems – Windows® 7, Windows® Embedded Standard 7 and Wind River Linux

CPU
• Intel® Core™ i7-2715QE / 2.1GHz, 45W
• Intel® Core™ i7-2655LE / 2.2GHz, 25W
• Intel® Core™ i7-2610UE / 1.5GHz, 17W
• Intel® Core™ i5-2515E / 2.5GHz, 35W
• Chipset: Mobile Intel®QM67
Memory
• Direct-mounted DDR3-1333 SDRAM up to 8GB, ECC supported
• Factory option configurations: 1GB/2GB/4GB/8GB
• Dual channel (1GB supports single channel only)
• Boot ROM: SPI-FLASH 8MB
COM EXPRESS
• PICMG COM.0 COM Express Module Base Specification Rev 1.0
• Basic Module size (125mm x 95mm)
• Type 2 Pin layout (SDVO replaces PATA)
SYSTEM I/O
• PCI Express 2.0: X16 1 port (X8 2 ports available as factory option),
X4 1 port (X1 4 ports available as factory option), X1 2 ports
• Graphics: Analog VGA / SDVO / LVDS 1 port each
• 2X SATA-600 + 2X SATA-300
• 8X USB 2.0
• 1X ETHERNET 10/100/1000BASE-T
• 1X PCI(32BIT, 33MHZ, 3.3V)
• 1X LPC
• 1x SMBUS
• 1x I2C BUS
• 4x GPI + 4X GPO
POWER
• Supply voltage:
DC 12V (VCC_12V) 12.0V, ±5%, max 13.4A
DC 5V (VCC_5VSBY) 5.0V, ±5%, max 0.8A
DC 3V (VCC_RTC) 3.0V, max 6uA
MECHANICAL
• 125mm (W) x 95mm (L) x 21mm (H)
(incl. 8mm height for heat spreader and spacers)
• Heat sink is optionally available
• Weight: 285g
ENVIRONMENTAL
• -40º to +85ºC
• Humidity: up to 80%RH (no condensation)
• RoHS compliant


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